Time |
Topics |
Speakers |
|
Executive AM Session |
|
9:00-9:15am
Exhibit Hall A |
Welcome, Agenda Overview & Introductions
(5 minutes) |
Dr. Gary Patton
Vice President, IBM Semiconductor Research and Development Center |
9:15-9:45am
Exhibit Hall A |
Keynote: Emerging Mobile Markets and Partnerships
(30 minutes) |
Michael Campbell, Senior Vice President, Engineering, Qualcomm CDMA Technologies
(Intro: C.S. Choi, Samsung) |
9:45-10:15 am |
Keynote: Enabling Web 2.0 Mobile Apps
(30 minutes) |
Tudor Brown
President, ARM
(Intro: Michael Cadigan, IBM) |
10:15-10:30am |
Mid-morning Break |
|
10:30- 11:00am
Exhibit Hall A |
Keynote: Leadership Technology Through Innovation and Collaboration
(30 minutes) |
Dr. Gary Patton
Vice President, IBM Semiconductor Research and Development Center |
11:00-11:30am
Exhibit Hall A |
Keynote
(30 minutes) |
Patrice Meilland, Group Vice President, ST-NXP Wireless
(Intro: Chia Song Hwee, Chartered) |
11:30-11:40 am
Exhibit Hall A |
Forum Logistics & Preview of Afternoon Sessions |
Kevin Meyer
Vice President, Industry Marketing and Platform Alliances, Chartered |
11:40am-1:00pm
Exhibit Hall C
Exhibit Hall B |
Lunch
Partner Pavilion |
|
1:00-2:00pm |
1st Breakout Track (Choose 1)
(60 minutes) |
|
Great America J
|
High-K Metal-Gate Designs for Low-Power Applications |
Dr. Richard Lindsay
32nm Technology Project Manager, Infineon Technologies
Dr. Kyu-Myung Choi
Vice President, System LSI Division
Samsung Electronics |
Great America K
|
32nm High-K Metal-Gate Silicon Implementation |
Dr. An Steegen
Sr. Manager, Technology Development, IBM Systems & Technology Group
Dr. Ron Sampson
Director and Project Leader, IBM Alliances, STMicroelectronics |
Exhibit Hall D
|
ARM Solutions for Common Platform Technology |
Dr. Rob Aitken,
R&D Fellow, ARM |
2:00-2:15 pm |
Break |
|
2:15-3:15 pm |
2nd Breakout Track (Choose 1)
(60 minutes) |
|
Great America J |
Energy-Aware, Multiprocessing Design |
Alan Gibbons
Principal Engineer, Synopsys |
Great America K |
32nm High-K Metal-Gate Silicon Implementation |
Dr. An Steegen
Sr. Manager, Technology Development, IBM Systems & Technology Group
Dr. Ron Sampson
Director and Project Leader, IBM Alliances, ST Microelectronics |
Exhibit Hall D |
Advanced Technology for Density and Performance Scaling |
Dr. Dario Gil, Manager of the Computational Scaling Group, IBM Semiconductor Research and Development Center
Dr. James Ryan
Founding Dean of the Joint School of Nanoscience and Nanoengineering of North Carolina A&T State University and UNC-Greensboro |
3:15-3:30pm |
Afternoon BREAK |
|
3:30-4:30pm |
3rd Breakout Track (Choose 1)
(60 minutes) |
|
Great America J
|
High-K Metal-Gate Designs for Low-Power Applications |
Dr. Richard Lindsay
32nm Technology Project Manager, Infineon Technologies
Dr. Kyu-Myung Choi
Vice President, System LSI Division
Samsung Electronics |
Great America K
|
Design Challenges & Methodology Solutions Spanning to 32nm |
Juan C. Rey
Sr. Engineering Director, Mentor Graphics
Richard Brashears
Corporate Vice President, Manufacturing Modeling and Implementation Technology, Cadence Design Systems
Dr. Tong Gao
Scientist, Synopsys |
Exhibit Hall D |
Advanced Technology for Density and Performance Scaling |
Dr. Dario Gil, Manager of the Computational Scaling Group, IBM Semiconductor Research and Development Center
Dr. James Ryan
Founding Dean of the Joint School of Nanoscience and Nanoengineering of North Carolina A&T State University and UNC-Greensboro |
4:30–6:00pm
Exhibit Hall B |
Afternoon Reception and Solution Provider Pavilion |
|
