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32nm, 45nm, 65nm and 90nm

At the core of the Common Platform vision is the acceleration of leading-edge technology availability to foundry customers. The Common Platform technology companies have established a track record of bringing new processes up at an extremely competitive rate that tracks to the ITRS roadmap, and in fact becoming the first foundries to announce silicon functional circuits at 45nm. By combining the expertise and research resources of all of its partners, the Common Platform foundries are able to drive innovation and production ramps faster than by operating as individual companies.

The added benefit is the process compatibility across 3 different fabs, which improves efficiency - time, costs, design migration, capacity - while also mitigating risk for the manufacturing partners and for their customers. Designs qualified and manufactured at one Common Platform fab can easily be sourced to another, and migration to next-generation nodes is also simplified.

The Common Platform's technology process offerings span from 90 nm to 65 nm to 45 nm, with high-performance and low-power variations available for each node. The process offerings are supported by robust design manuals and a common SPICE model. Production on all 3 nodes at each fab is on 300 mm silicon wafers. Development activities for the Common Platform technology 32 nm process offerings are underway.

As process technology pushes ahead to more advanced nodes, the Common Platform fabs are leading the way with advances such as 193-nm immersion lithography, ultra low-k dielectrics and high-k metal gate "gate-first" technology.

Working together with third-party providers of design tools and open-standard formats, the Common Platform team is assisting foundry customers in designing with these advanced technologies, with the goal of helping them to achieve success silicon at one or more of the Common Platform manufacturers.



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