Technology

The combined expertise of the Common Platform alliance partners has been instrumental in driving innovation in semiconductor manufacturing. The accelerated roadmap and deep technical offering make the Common Platform a valuable manufacturing resource for leading edge fabless, fab-lite and IDM companies around the world.

At the heart of the Common Platform technology relationship is the bulk CMOS process technology that is jointly developed by IBM, Chartered, and Samsung. The group began with joint development at the 90nm process node and has extended the joint development to 65nm, 45nm and 32nm processes. There are currently over 300 process development engineers from IBM and nearly 40 process engineers from Chartered and another 40 from Samsung working together at IBM's 300mm fab in East Fishkill, New York.

On top of that, the Common Platform solution consists of a complete range of design enablement support from leading EDA, library and IP, and design services providers.

Complete solutions for 45nm, 65nm and 90nm

Reference Design Flows
Design Center Collaborators
Libraries and IP
Technology Design Kits
Design Manual SPICE Models
45nm, 65nm and 90nm Process Platforms
32nm Process Platform development underway