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The Common Platform invests heavily in processes and equipment required for fab synchronization. This is achieved by using common test vehicles to drive understanding of the process. Common in line electrical test specs and wafer acceptance criteria are needed across all fabs. Critical parameters need to be monitored and tweaks fed back to litho, OPC, data prep, metrology and masking making. Hardware must be measured to ensure parameter equivalency. Yield and reliability are driven by SRAMs, customer macros and real product. Common L1/L2 qualification methods are used.

A core value proposition of the Common Platform is the compatibility among all three manufacturing partners' fabs. The result is having three foundries that can act individually or as one. In the latest report on fab synchronization, all three factories are centered on all 65nm low power device parameters within less than 5% deviation.

There are two over lapping sub-levels of fab synchronization:

Process Sync: Permitting customers to release their design into any of the Common Platform partner's fabs (GDSII compatibility) without re-design. All partner fabs are parametrically equivalent.

Product Sync: Customer support for selected products by a platform characterization team to aid and join, rapid product functional yield learning consistently across the partner fabs.

Core Activities of 3-Way Fab Sync

Core Activities

  • Process
  • Process change control
  • In-line specs & Cp, Cpk
  • Critical layer CD & thickness
  • ORC critical features

  • Device
  • ILETs / WAC specs & Cp,Cpk
  • Scribe line structures, test condition,
        Hardware-to-Model Correlation
  • Fabs will be parametrically equivalent

  • Yield & Reliability
  • Process change control
  • In-line specs & Cp, Cpk
  • Critical layer CD & thickness
  • ORC critical features

    •  Management Process
     Transfer Vehicle/Common Product
     ILETs/WAC
    Scribe-line test sync
     Construction analysis
    • Convergence
    • Control of future changes
     Litho
     OPC
     Dataprep
     Metrology
     Mask

     Hardware-to-Model Correlation
     Qualification Sync
    • L1
    • L2
     ARM Library
     SRAM Yield; Dº