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Design. Manufacturing. Choice.

The Common Platform technology approach can help maximize your flexibility and choice. Together, IBM, Chartered Semiconductor Manufacturing and Samsung offer industry breadth and depth to address the complex design challenges you face. Each company delivers unique expertise to solve semiconductor industry and client-specific challenges.

Customers can utilize one or multiple partners for manufacturing through an approach that offers not only multiple fabs, but fabs that are geographically diverse. Thus, semiconductor designs can be produced in different fabs for different customers or regions, greatly reducing supply chain costs in a global environment.

Just as the global diversity of the manufacturing sites also mitigates risk, it also provides more manufacturing and engineering support. With the fabs located in Singapore, South Korea, and the East Coast of the United States, multiple engineering teams at multiple fabs can be working to resolve issues and improve manufacturing efficiency around the clock, rather than a single fab and engineering team in the traditional foundry model. With knowledge in different products and application areas, the Common Platform technology partners and their joint development alliance partners also offer a wide range of expertise and experience. This knowledge and support can be critical during the ramp of a new product. With three distinct companies joining together to coordinate yield ramps, various resources have been cross-geographically leveraged. Such resources include wafers and indigenous processes for yield learning and engineering talent and have led to cost reductions and industry-leading ramp times.


IBM
East Fishkill Site, USA
Chartered
Woodlands Campus, Singapore
Samsung
S1 Line, South Korea
IBM East Fishkill Site, USA Chartered, Woodlands Campus, Singapore Samsung S1 Line, South Korea