Groundbreaking Collaboration

For over a decade, the Common Platform, an alliance of IBM, Samsung and GLOBALFOUNDRIES, has been leveraging its combined expertise to address today's demanding IC design and manufacturing challenges. This collaborative research and innovative technology development has resulted in an accelerated roadmap and rapid customer adoption.

With bulk 32/28nm and earlier technology nodes already in volume production and 20nm development near completion, dedicated resources from IBM, Samsung and GLOBALFOUNDRIES are focused on the development of the 14nm bulk node which will introduce FinFET technology, providing the next generation of process scaling with low voltage operation.

Our comprehensive and open ecosystem of industry leading design enablement and implementation companies deliver optimized solutions targeted for the mobile world.